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SOD-323HE Package Transient Voltage SuppressorsBackPDF
Introduction
1. Excellent heat dissipation performance: The Pad area on the back is large. Compared with the SOD-123FL, the heat dissipation path has been changed from the original pin heat dissipation to the metal plate Pad heat dissipation on the back, increasing the metal heat dissipation area by 89%
2. Small package size: Compared with SOD-123HE, the package length is reduced by 56% and the width by 56%, meeting the development trend of package miniaturization
Features
1. Ultra-thin packaging shape, which can be applied to miniaturized and thinned circuits;
2. The bottom surface of the package is equipped with a heat sink, providing excellent heat dissipation performance.
3. Use environmentally friendly materials and comply with RoHS standards;
4. It is widely applied in secondary rectifier circuits, converters, freewhew diodes, AC/DC power supply protection, etc.